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Qualcomm Advances 2nm Breakthrough, Aligning With India’s Design Push

Qualcomm’s successful tape-out of its 2-nanometre semiconductor design represents a defining moment in next-generation chip development. A tape-out signals that a processor’s architecture has progressed from modelling and verification to readiness for fabrication—an achievement that reflects technological maturity and ecosystem strength.

At the 2nm node, improvements in transistor density, power efficiency, and thermal performance can significantly elevate capabilities across AI engines, smartphones, vehicles, and hyperscale infrastructure. Such gains are essential as computing demand accelerates worldwide.

The development also dovetails with India’s semiconductor strategy. Policymakers have been clear that while leading-edge fabrication may take time, India can secure global relevance by excelling in design, intellectual property, and system engineering.

Speaking at the event, IT Minister Ashwini Vaishnaw reiterated the priorities of the India Semiconductor Mission 2.0: design leadership first, then equipment and materials, supported by deep investments in talent. The approach aims to anchor innovation before expanding manufacturing capacity.

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